Wafer book cutter type MBWCT

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Machine Details

Cut the wafer books discharged from the wafer book cooler to smaller wafer fingers in the desired size
Fully automatic operation
Cutting of single or several stacked wafer books is possible
Different product sizes are possible by exchangeable cutting frames with cutting wires or cutting blades (depending on application)
Tandem or twin cutter versions allow higher capacities and simultaneous production of wafer fingers in two different sizes
Combination with evacuator and shredder allows automatic recycling of wafer waste for wafer cream production.
Good access through side doors for cleaning and maintenance.

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