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Wafer book cooler
Machine Details
Specifications
USED FOR THE COOLING OF CREAM-FILLED WAFER BOOKS AFTER SPREADING AND BEFORE CUTTING A COOLING TIME OF 10 MIN
UP TO ABOUT 1100 BOOKS/H CAN BE PROCESSED
LITTLE SPACE REQUIREMENTS
QUICK COOLING OF THE PRODUCTS BY DIRECT CONTACT WITH THE COOLING TONGS OR COOLING COMPARTMENTS
MODULAR DESIGN ALLOWS LATER CAPACITY UPGRADINGS
GOOD ACCESS THROUGH SIDE DOORS FOR CLEANING AND MAINTENANCE
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