Wafer book cooler

Machine Details

Specifications

  • USED FOR THE COOLING OF CREAM-FILLED WAFER BOOKS AFTER SPREADING AND BEFORE CUTTING A COOLING TIME OF 10 MIN
  • UP TO ABOUT 1100 BOOKS/H CAN BE PROCESSED
  • LITTLE SPACE REQUIREMENTS
  • QUICK COOLING OF THE PRODUCTS BY DIRECT CONTACT WITH THE COOLING TONGS OR COOLING COMPARTMENTS
  • MODULAR DESIGN ALLOWS LATER CAPACITY UPGRADINGS
  • GOOD ACCESS THROUGH SIDE DOORS FOR CLEANING AND MAINTENANCE

 

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