Wafer separators

Machine Details


  • Cut the wafer books discharged from the wafer book cooler to smaller wafer fingers in the desired size
  • Up to 28 cuts/min are possible
  • Fully automatic operation
  • Cutting of single or several stacked wafer books possible
  • Different product sizes are possible by exchangeable cutting frames with cutting wires or cutting blades (depending on application)
  • Tandem or twin cutter versions allow higher capacities and simultaneous production of wafer fingers in two different sizes
  • Combination with evacuator and shredder allows automatic recycling of wafer waste for wafer cream production
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