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Wafer separators
Machine Details
Cut the wafer books discharged from the wafer book cooler to smaller wafer fingers in the desired size
Up to 28 cuts/min are possible
Fully automatic operation
Cutting of single or several stacked wafer books possible
Different product sizes are possible by exchangeable cutting frames with cutting wires or cutting blades (depending on application)
Tandem or twin cutter versions allow higher capacities and simultaneous production of wafer fingers in two different sizes
Combination with evacuator and shredder allows automatic recycling of wafer waste for wafer cream production
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